The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2012

Filed:

Mar. 05, 2010
Applicants:

Ping Kong Choy, Kwai Chung, HK;

Chung Sheung Yung, Kwai Chung, HK;

Hon Yu NG, Kwai Chung, HK;

Inventors:

Ping Kong Choy, Kwai Chung, HK;

Chung Sheung Yung, Kwai Chung, HK;

Hon Yu Ng, Kwai Chung, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.


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