The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2012

Filed:

Aug. 13, 2010
Applicants:

Jen-chuan Yeh, Changhua County, TW;

Jyong-yue Tian, Taichung County, TW;

Kuo-ting Lee, Nantou County, TW;

Inventors:

Jen-Chuan Yeh, Changhua County, TW;

Jyong-Yue Tian, Taichung County, TW;

Kuo-Ting Lee, Nantou County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.


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