The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2012

Filed:

Jan. 08, 2008
Applicants:

Yong Goo Lee, Seoul, KR;

Maeng Youl Lee, Seoul, KR;

Inventors:

Yong Goo Lee, Seoul, KR;

Maeng Youl Lee, Seoul, KR;

Assignee:

Gigalane Co., Ltd., Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals. In the probe card of the present invention, the probe units are independently supported by respective space transformers such that it is possible to reduce thermal distortion of the probe card and simplifying the manufacturing and repairing processes.


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