The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Jun. 26, 2009
Applicants:

Matthias A. Blumrich, Ridgefield, CT (US);

Dong Chen, Croton On Hudson, NY (US);

George L. Chiu, Cross River, NY (US);

Thomas M. Cipolla, Cross Katonah, NY (US);

Paul W. Coteus, Yorktown Heights, NY (US);

Alan G. Gara, Mount Kisco, NY (US);

Mark E. Giampapa, Irvington, NY (US);

Philip Heidelberger, Cortlandt Manor, NY (US);

Gerard V. Kopcsay, Yorktown Heights, NY (US);

Lawrence S. Mok, Brewster, NY (US);

Todd E. Takken, Mount Kisco, NY (US);

Inventors:

Matthias A. Blumrich, Ridgefield, CT (US);

Dong Chen, Croton On Hudson, NY (US);

George L. Chiu, Cross River, NY (US);

Thomas M. Cipolla, Cross Katonah, NY (US);

Paul W. Coteus, Yorktown Heights, NY (US);

Alan G. Gara, Mount Kisco, NY (US);

Mark E. Giampapa, Irvington, NY (US);

Philip Heidelberger, Cortlandt Manor, NY (US);

Gerard V. Kopcsay, Yorktown Heights, NY (US);

Lawrence S. Mok, Brewster, NY (US);

Todd E. Takken, Mount Kisco, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 15/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System- On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node individually or simultaneously work on any combination of computation or communication as required by the particular algorithm being solved. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. The multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions.


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