The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Mar. 31, 2010
Jyh-rong Lin, Taipei, TW;
Ming LU, Taipei, TW;
Jyh-Rong Lin, Taipei, TW;
Ming Lu, Taipei, TW;
Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, New Territories, HK;
Abstract
The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced.