The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Dec. 29, 2009
Applicant:
Tsorng-dih Yuan, Hsinchu, TW;
Inventor:
Tsorng-Dih Yuan, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A flip chip semiconductor package is provided. In one embodiment, the flip chip semiconductor package comprises a first substrate having a first surface and a second surface opposite the first surface, a semiconductor chip mounted on the first surface of the first substrate by solder bumps, a thermally-conductive stiffener mounted above the first surface of the first substrate and around the chip to define a cavity region therebetween, one or more molding compound material disposed in the cavity region, and a second substrate mounted to the second surface of the first substrate by solder balls.