The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Aug. 31, 2009
Applicant:

Chuen-shu Hou, Taipei Hsien, TW;

Inventor:

Chuen-Shu Hou, Taipei Hsien, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a plate-type heat pipe includes providing a mold including a first cavity and a plurality of second cavities and depositing cores into the mold. Each core has a first portion in the first cavity and a second portion in a corresponding second cavity. First and second metal powder are filled into the mold. The cores are then removed from the mold to form a green piece by the first and second metal powder, which has first and second chambers therein. The green piece is sintered, whereby the first metal powder forms an outer wall of the heat pipe and the second metal powder forms a wick structure. The heat pipe has a heat absorbing portion having the first chambers and fins having the second chambers communicating with the first chambers.


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