The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Jun. 02, 2009
Yun-zong Tian, Taichung County, TW;
Chun Chi Chen, Taipei, TW;
Yi Feng Lee, Taichung County, TW;
Wei Jun Chen, Taichung County, TW;
Shih Chang Kao, Kaoshiung, TW;
Yij Chieh Chu, Taipei County, TW;
Cheng-hao Chen, Taipei, TW;
Yun-Zong Tian, Taichung County, TW;
Chun Chi Chen, Taipei, TW;
Yi Feng Lee, Taichung County, TW;
Wei Jun Chen, Taichung County, TW;
Shih Chang Kao, Kaoshiung, TW;
Yij Chieh Chu, Taipei County, TW;
Cheng-Hao Chen, Taipei, TW;
Inotera Memories, Inc., Taoyuan County, TW;
Abstract
A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.