The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Jun. 30, 2009
Applicants:

Feng Jin, Shenzhen, CN;

Gen-ping Deng, Shenzhen, CN;

Chun-chi Chen, Taipei Hsien, TW;

Inventors:

Feng Jin, Shenzhen, CN;

Gen-Ping Deng, Shenzhen, CN;

Chun-Chi Chen, Taipei Hsien, TW;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 41/00 (2006.01); B23D 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.


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