The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Oct. 07, 2009
Hung-yi Liu, Pingjhen, TW;
Chung-hsing Wang, Baoshan Townhship, Hsinchu County, TW;
Agrawal Aditya Binodkumar, Bihar, IN;
Hung-Yi Liu, Pingjhen, TW;
Chung-Hsing Wang, Baoshan Townhship, Hsinchu County, TW;
Agrawal Aditya Binodkumar, Bihar, IN;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A system and method for computer-aided design of semiconductor integrated circuit devices provides for having dummy vias beneath UBM of bump cells to prevent delamination at the bump cell sites during bonding. The dummy vias are inserted into the design and bump cell placement occurs during the floorplanning stage and prior to placement and routing of the active integrated circuit components. In this manner, a sufficiently high via density is achieved and design information on the bump cells including the dummy vias is provided to a computer-aided design, CAD, system along with program instructions for carrying out the indicated sequence of design operations.