The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Sep. 02, 2010
Tzu Ling Wong, Kuala Lumpur, MY;
Boon Yew Low, Petaling Jaya, MY;
Vemal Raja Manikam, Shah Alam, MY;
Vittal Raja Manikam, Shah Alam, MY;
Tzu Ling Wong, Kuala Lumpur, MY;
Boon Yew Low, Petaling Jaya, MY;
Vemal Raja Manikam, Shah Alam, MY;
Vittal Raja Manikam, Shah Alam, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are trapped between the tape and the die and underfill material. The tape can be weighted and lined with an adhesive material. The tape aids in preventing the die from cracking due to mishandling.