The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Apr. 13, 2010
Robert C. Anderson, Tucson, AZ (US);
Randy J. Shul, Albuquerque, NM (US);
Peggy J. Clews, Tijeras, NM (US);
Michael S. Baker, Albuquerque, NM (US);
Maarten P. DE Boer, Albuquerque, NM (US);
Robert C. Anderson, Tucson, AZ (US);
Randy J. Shul, Albuquerque, NM (US);
Peggy J. Clews, Tijeras, NM (US);
Michael S. Baker, Albuquerque, NM (US);
Maarten P. De Boer, Albuquerque, NM (US);
Sandia Corporation, Albuquerque, NM (US);
Abstract
A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.