The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Dec. 20, 2010
Jay Sanford Burnham, Fletcher, VT (US);
Joseph Kerry Vaughn Comeau, Essex Junction, VT (US);
Leslie Peter Crane, Williston, VT (US);
James Randall Elliott, Richmond, VT (US);
Scott Alan Estes, Essex Junction, VT (US);
James Spiros Nakos, Essex Junction, VT (US);
Eric Jeffrey White, Charlotte, VT (US);
Jay Sanford Burnham, Fletcher, VT (US);
Joseph Kerry Vaughn Comeau, Essex Junction, VT (US);
Leslie Peter Crane, Williston, VT (US);
James Randall Elliott, Richmond, VT (US);
Scott Alan Estes, Essex Junction, VT (US);
James Spiros Nakos, Essex Junction, VT (US);
Eric Jeffrey White, Charlotte, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of monitoring copper contamination. The method includes method, comprising: (a) ion-implanting an N-type dopant into a region of single-crystal silicon substrate, the region abutting a top surface of the substrate; (c) activating the N-type dopant by annealing the substrate at a temperature of 500° C. or higher in an inert atmosphere; (c) submerging, for a present duration of time, the substrate into an aqueous solution, the aqueous solution to be monitored for copper contamination; and (d) determining an amount of copper adsorbed from the aqueous solution by the region of the substrate.