The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2012

Filed:

Jun. 14, 2010
Applicants:

Yat Kit Tsui, Tuen Mun, HK;

Dan Yang, Fanling, HK;

Xunqing Shi, Taiwai, HK;

Inventors:

Yat Kit Tsui, Tuen Mun, HK;

Dan Yang, Fanling, HK;

Xunqing Shi, Taiwai, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/44 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic or micromechanical device having first () and second () surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (), second () and third () portions. The first portion () extends from the first surface () to the second surface (). The second portion () extends over a part of the first surface () of the device. The third portion () extends over a part of the second surface () of the device. Preferably the first portion comprises first and second parts, the second part extending through an active region of the device and having a narrower width than the first part. A method of forming and filling the via is also disclosed.


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