The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Aug. 21, 2008
Marcel Broekaart, Theys, FR;
Bernard Aspar, St Ismier, FR;
Thierry Barge, Grenoble, FR;
Chrystelle L. Blanchard, Crolles, FR;
Marcel Broekaart, Theys, FR;
Bernard Aspar, St Ismier, FR;
Thierry Barge, Grenoble, FR;
Chrystelle L. Blanchard, Crolles, FR;
S.O.I.TEC Silicon on Insulator Technologies, Bernin, FR;
Abstract
The invention relates to a process of bonding by molecular adhesion of two layers, such as wafers of semiconductor material, wherein propagation of a first bonding wave is initiated from a pressure point applied to at least one of the two layers, and wherein the first bonding wave step is followed by propagating a second bonding wave over an area, for example, in the vicinity of the pressure point. Propagation of the second bonding wave may be obtained through the interposing of a separation element between the two wafers and the withdrawal of the element, for example, after the beginning of the first bonding wave propagation.