The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Mar. 03, 2009
Andy Tsen, Chung-Ho, TW;
Chih-wei Hsu, Chuang-Hua, TW;
Ming-yeon Hung, Hsinchu, TW;
Ming-yu Fan, Hsinchu County, TW;
Wang JO Fei, Hsinchu, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Andy Tsen, Chung-Ho, TW;
Chih-Wei Hsu, Chuang-Hua, TW;
Ming-Yeon Hung, Hsinchu, TW;
Ming-Yu Fan, Hsinchu County, TW;
Wang Jo Fei, Hsinchu, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of advanced process control (APC) for semiconductor fabrication is provided. The method includes providing a present wafer to be processed by a semiconductor processing tool, providing first data of previous wafers that have been processed by the semiconductor processing tool, decoupling noise from the first data to generate second data, evaluating an APC performance based on proximity of the second data to a target data, determining a control parameter based on the APC performance, and controlling the semiconductor processing tool with the control parameter to process the present wafer.