The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Sep. 12, 2006
Thomas Cowan, Dresden, DE;
Steven Malekos, Reno, NV (US);
Grant Korgan, Reno, NV (US);
Jesse Adams, Reno, NV (US);
Yasuhiko Sentoku, Reno, NV (US);
Nathalie Le Galloudec, Reno, NV (US);
Julien Fuchs, Paris, FR;
Thomas Cowan, Dresden, DE;
Steven Malekos, Reno, NV (US);
Grant Korgan, Reno, NV (US);
Jesse Adams, Reno, NV (US);
Yasuhiko Sentoku, Reno, NV (US);
Nathalie Le Galloudec, Reno, NV (US);
Julien Fuchs, Paris, FR;
Abstract
In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 μm. In particular examples, the distance is less than about 1 μm. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.