The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Oct. 08, 2007
Shih-hsun Hsu, Hsin-Chu, TW;
Hao-yi Tsai, Hsin-Chu, TW;
Benson Liu, Taipei, TW;
Chia-lun Tsai, Hsin-Chu, TW;
Hsien-wei Chen, Sinying, TW;
Anbiarshy N. F. Wu, Chiayi, TW;
Shang-yun Hou, Jubei, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Shih-Hsun Hsu, Hsin-Chu, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Benson Liu, Taipei, TW;
Chia-Lun Tsai, Hsin-Chu, TW;
Hsien-Wei Chen, Sinying, TW;
Anbiarshy N. F. Wu, Chiayi, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A bonding pad design is disclosed that includes one or more pad groups on a semiconductor device. Each pad group is made up of two or more bonding pads that have an alternating orientation, such that adjacent bonding pads have their bond ball on opposite sides in relation to the adjacent bonding pad.