The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
May. 17, 2009
Chung-jen Tsai, Tayuan, TW;
Yu-cheng Huang, Tayuan, TW;
Hung-yi Chang, Tayuan, TW;
Cheng-hsien Lin, Tayuan, TW;
Chung-Jen Tsai, Tayuan, TW;
Yu-Cheng Huang, Tayuan, TW;
Hung-Yi Chang, Tayuan, TW;
Cheng-Hsien Lin, Tayuan, TW;
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Abstract
A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.