The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
May. 18, 2007
Applicants:
Akio Furusawa, Osaka, JP;
Kenichiro Suetsugu, Hyogo, JP;
Shigeki Sakaguchi, Kyoto, JP;
Kimiaki Nakaya, Osaka, JP;
Inventors:
Akio Furusawa, Osaka, JP;
Kenichiro Suetsugu, Hyogo, JP;
Shigeki Sakaguchi, Kyoto, JP;
Kimiaki Nakaya, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.