The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Jun. 30, 2008
Applicants:

Noam Avni, Jerusalem, IL;

Amit Zeevi, Ra'anana, IL;

Yavir Navot, Naharia, IL;

Motti Haller, Haifa, IL;

Inventors:

Noam Avni, Jerusalem, IL;

Amit Zeevi, Ra'anana, IL;

Yavir Navot, Naharia, IL;

Motti Haller, Haifa, IL;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die. In some embodiments, a method includes providing a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; mounting an integrated circuit die to one of the outer surfaces, mounting a crystal oscillator to one of the outer surfaces; and electrically connecting the crystal oscillator to the integrated circuit die.


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