The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Mar. 30, 2010
Applicants:
Ming-fa Chen, Taichung, TW;
I-ching Lin, Taipei, TW;
Inventors:
Ming-Fa Chen, Taichung, TW;
I-Ching Lin, Taipei, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material outside the contact hole and the TSV opening to leave the conductive material in the contact hole and the TSV opening, thereby forming a contact plug and a TSV structure, respectively. In some embodiments, the removing step is performed by a CMP process.
Quick Actions:
Chen, Ming-Fa. (2012). Chemical mechanical polishing (cmp) processing of through-silicon via (tsv) and contact plug simultaneously (U.S. Patent No. 8222139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8222139
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile