The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8220685 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 17, 2012

Filed:

Sep. 08, 2005
Applicants:

Paul C. Lindsey, Jr., Lafayette, CA (US);

Christopher K. Lindsey, Lafayette, CA (US);

Jeffery D. Atkinson, Sebastopol, CA (US);

Inventors:

Paul C. Lindsey, Jr., Lafayette, CA (US);

Christopher K. Lindsey, Lafayette, CA (US);

Jeffery D. Atkinson, Sebastopol, CA (US);

Assignee:

Micro Processing Technology, Inc., Lafayette, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26F 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and method for breaking a scribed semiconductor wafer utilizes two vacuum chucks, at least one of the vacuum chucks pivotable about a pivot line. The scribe line is aligned with the pivot line and relative movement between the vacuum chucks causes bending forces to be applied to the wafer and breakage of the wafer along the scribe line.


Find Patent Forward Citations

Lindsey, Jr., Paul. (2012). System for breaking a semiconductor wafer or other workpiece along a scribe line (U.S. Patent No. 8220685). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8220685

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…