The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Dec. 18, 2009
Applicants:

Shinichiro Hidaka, Chiyoda-ku, JP;

Masahiro Kawai, Chiyoda-ku, JP;

Yuji Ariyoshi, Chiyoda-ku, JP;

Hiroyuki Uramachi, Chiyoda-ku, JP;

Inventors:

Shinichiro Hidaka, Chiyoda-ku, JP;

Masahiro Kawai, Chiyoda-ku, JP;

Yuji Ariyoshi, Chiyoda-ku, JP;

Hiroyuki Uramachi, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

Although flow detection accuracy deterioration due to a subject fluid inflow into a gap between a sensor device and an engaging portion is prevented by an underflow inhibitor, the underflow inhibitor overflow to a sensor device surface results in the subject fluid turbulence, causing a flow element output fluctuation risk. One solution is a configuration comprising a sensor device made of a planar semiconductor material with a heating element and an intake air temperature detection element formed thereon, a support member containing an engaging portion the sensor device is engaged to, which is placed at a passage the subject fluid circulates and underflow inhibitor being filled into a void between the sensor device and the support member to prevent the subject fluid from flowing into the void, and a pooling portion being placed to prevent the under flow inhibitor from overflowing out of the void.


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