The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Oct. 22, 2009
Tsutomu Kono, Chiyoda-ku, JP;
Masayuki Mino, Chiyoda-ku, JP;
Hidehiro Takeshima, Chuo-ku, JP;
Youkou Ito, Chuo-ku, JP;
Tomoko Goi, Chuo-ku, JP;
Tsutomu Kono, Chiyoda-ku, JP;
Masayuki Mino, Chiyoda-ku, JP;
Hidehiro Takeshima, Chuo-ku, JP;
Youkou Ito, Chuo-ku, JP;
Tomoko Goi, Chuo-ku, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.