The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jun. 16, 2009
Charles Edward Baumgartner, Niskayuna, NY (US);
Jean-francois Gelly, Mougins, FR;
Lowell Smith, Niskayuna, NY (US);
Charles G. Woychik, Niskayuna, NY (US);
Frederic Lanteri, Le Cannet, FR;
Stephen Edwardsen, Revetal, NO;
Robert S. Lewandowski, Amsterdam, NY (US);
Charles Edward Baumgartner, Niskayuna, NY (US);
Jean-Francois Gelly, Mougins, FR;
Lowell Smith, Niskayuna, NY (US);
Charles G. Woychik, Niskayuna, NY (US);
Frederic Lanteri, Le Cannet, FR;
Stephen Edwardsen, Revetal, NO;
Robert S. Lewandowski, Amsterdam, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.