The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jun. 09, 2009
Min-hsun Hsieh, Hsinchu, TW;
Chih-chiang LU, Hsinchu, TW;
Chien-yuan Wang, Hsinchu, TW;
Yen-wen Chen, Hsinchu, TW;
Jui-hung Yeh, Hsinchu, TW;
Shih-chin Hung, Hsinchu, TW;
Yu-wei Tu, Hsinchu, TW;
Chun-yi Wu, Hsinchu, TW;
Wei-chih Peng, Hsinchu, TW;
Min-Hsun Hsieh, Hsinchu, TW;
Chih-Chiang Lu, Hsinchu, TW;
Chien-Yuan Wang, Hsinchu, TW;
Yen-Wen Chen, Hsinchu, TW;
Jui-Hung Yeh, Hsinchu, TW;
Shih-Chin Hung, Hsinchu, TW;
Yu-Wei Tu, Hsinchu, TW;
Chun-Yi Wu, Hsinchu, TW;
Wei-Chih Peng, Hsinchu, TW;
Epistar Corporation, Hsinchu, TW;
Abstract
A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.