The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jul. 15, 2010
Akio Hasebe, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Yasunori Narizuka, Tokyo, JP;
Seigo Nakamura, Tokyo, JP;
Kenji Kawakami, Tokyo, JP;
Akio Hasebe, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Yasunori Narizuka, Tokyo, JP;
Seigo Nakamura, Tokyo, JP;
Kenji Kawakami, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.