The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Mar. 23, 2007
Chris Wyland, Livermore, CA (US);
Chris Wyland, Livermore, CA (US);
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device () mounted onto a die attachment area (); the semiconductor device has a plurality of bonding pads (). A lead frame having a plurality of bonding fingers () surrounds the die attachment area. A plurality of mutually isolated connection conductors () having respective first ends are attached to respective bonding pads on the semiconductor device and the plurality of mutually isolated connection conductors having respective second respective second ends are attached to respective bonding fingers of the lead frame. An insulating material () coats at least a portion of the plurality of mutually isolated connection conductors. The mutually isolated connection conductors may include a bond wire () for the signal connection and a conductive strap () for the voltage reference connection. The insulating material () coating the bond wires reduces the likelihood of short circuits during encapsulation.