The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Oct. 16, 2007
Applicants:
Chan Ha Hwang, Kyunggi-do, KR;
DO Hyun NA, Seoul, KR;
Chang Deok Lee, Kyunggi-do, KR;
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond pad and a method of making the same for a semiconductor die has a bonding region formed on the bond pad. A test region is formed on the bond pad and is adjacent to the bonding region.