The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2012

Filed:

Sep. 16, 2008
Applicants:

David P. Mancini, Fountain Hills, AZ (US);

Young Sir Chung, Chandler, AZ (US);

William J. Dauksher, Mesa, AZ (US);

Donald F. Weston, Phoenix, AZ (US);

Steven R. Young, Gilbert, AZ (US);

Robert W. Baird, Gilbert, AZ (US);

Inventors:

David P. Mancini, Fountain Hills, AZ (US);

Young Sir Chung, Chandler, AZ (US);

William J. Dauksher, Mesa, AZ (US);

Donald F. Weston, Phoenix, AZ (US);

Steven R. Young, Gilbert, AZ (US);

Robert W. Baird, Gilbert, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

In accordance with a specific embodiment, a method of processing a semiconductor substrate is disclosed whereby the substrate is thinned, and the dice formed on the substrate are singulated by a common process. Trench regions are formed on a backside of the substrate. An isotropic etch of the backside results in a thinning of the substrate while maintaining the depth of the trenches, thereby facilitating singulation of the die.


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Mancini, David. (2012). Ultra-thin die and method of fabricating same (U.S. Patent No. 8198705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8198705

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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