The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Sep. 16, 2008
David P. Mancini, Fountain Hills, AZ (US);
Young Sir Chung, Chandler, AZ (US);
William J. Dauksher, Mesa, AZ (US);
Donald F. Weston, Phoenix, AZ (US);
Steven R. Young, Gilbert, AZ (US);
Robert W. Baird, Gilbert, AZ (US);
David P. Mancini, Fountain Hills, AZ (US);
Young Sir Chung, Chandler, AZ (US);
William J. Dauksher, Mesa, AZ (US);
Donald F. Weston, Phoenix, AZ (US);
Steven R. Young, Gilbert, AZ (US);
Robert W. Baird, Gilbert, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
In accordance with a specific embodiment, a method of processing a semiconductor substrate is disclosed whereby the substrate is thinned, and the dice formed on the substrate are singulated by a common process. Trench regions are formed on a backside of the substrate. An isotropic etch of the backside results in a thinning of the substrate while maintaining the depth of the trenches, thereby facilitating singulation of the die.