The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Sep. 29, 2004
Masaki Tsujimoto, Itabashi-ku, JP;
Kenji Kobayashi, Itabashi-ku, JP;
Takahisa Yoshioka, Itabashi-ku, JP;
Masaki Tsujimoto, Itabashi-ku, JP;
Kenji Kobayashi, Itabashi-ku, JP;
Takahisa Yoshioka, Itabashi-ku, JP;
Lintec Corporation, Tokyo, JP;
Abstract
There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatussticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table. The mounting apparatusincludes a pre-cut meansfor forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking meansfor peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.