The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Aug. 19, 2008
Myeong-soon Park, Seoul, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Seok-ho Kim, Bucheon-si, KR;
Ki-hyuk Kim, Yongin-si, KR;
Chang-woo Shin, Gunpo-si, KR;
Myeong-soon Park, Seoul, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Seok-ho Kim, Bucheon-si, KR;
Ki-hyuk Kim, Yongin-si, KR;
Chang-woo Shin, Gunpo-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package may have a semiconductor chip that includes a chip pad formed on a substrate including an integrated circuit, and a passivation layer exposing the chip pad, a first redistribution wiring layer that is connected to the chip pad and extends on the semiconductor chip and includes a wire bonding pad to provide wire bonding and a first solder pad to connect the first redistribution wiring layer to a second semiconductor chip, and a second redistribution wiring layer that is connected to the first redistribution wiring layer on the first redistribution wiring layer and includes a second solder pad to connect the second redistribution wiring layer to a third semiconductor chip.