The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Oct. 09, 2007
Hiroya Kobayashi, Hamamatsu, JP;
Yasuhito Miyazaki, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hiroya Kobayashi, Hamamatsu, JP;
Yasuhito Miyazaki, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
In a photodetecting device, a wiring boardis provided at the front surface side of a photodetecting elementso that a first bonding pad regionformed on the front surface of the photodetecting elementis exposed, and second bonding padsB are formed, of the wiring board, in the region on a further inner side than first bonding padsA. Thereby, in the photodetecting device, a forming space for wire bonding can be located at the inside of the photodetecting element, so that the wiring boardand the photodetecting elementcan be made almost equal in size. As a result, in the photodetecting device, the area that the photodetecting elementoccupies relative to the photodetecting devicecan be sufficiently secured, and minimization of the non-sensitive region in the case of a buttable arrangement of the photodetecting deviceson a cold platecan be realized.