The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8188377 B1

PDF
Full Text
Expired
Date of Patent:
May. 29, 2012

Filed:

Aug. 21, 2008
Applicants:

Wen-hung HU, Hsin-Chu, TW;

Wen-yuan Chi, Hsin-Chu, TW;

Inventors:

Wen-Hung Hu, Hsin-Chu, TW;

Wen-Yuan Chi, Hsin-Chu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection. The conductive posts and electrically connecting pads are absent from the insulating protective layer beneath the standalone metal pads, such that circuits can be formed under the insulating protective layer.


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