The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8183127 B1

PDF
Full Text
Expired
Date of Patent:
May. 22, 2012

Filed:

May. 24, 2010
Applicants:

Robert Patti, Warrenville, IL (US);

Sangki Hong, Singapore, SG;

Ramasamy Chockalingam, Singapore, SG;

Inventors:

Robert Patti, Warrenville, IL (US);

Sangki Hong, Singapore, SG;

Ramasamy Chockalingam, Singapore, SG;

Assignee:

Tezzaron Semiconductor, Inc., Naperville, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.


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Patti, Robert. (2012). Method for bonding wafers to produce stacked integrated circuits (U.S. Patent No. 8183127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8183127

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