The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8182632 B1

PDF
Full Text
Expired
Date of Patent:
May. 22, 2012

Filed:

Jun. 17, 2008
Applicants:

Hideo Kino, Mitaka, JP;

Minoru Amatani, Mitaka, JP;

Inventors:

Hideo Kino, Mitaka, JP;

Minoru Amatani, Mitaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The wafer table () for holding a wafer () having the back surface thereof supported by a mount frame () via a dicing film () and the front surface thereof with a surface protective film () attached thereon is described. A groove () is formed in the area of the table corresponding to at least a part of the outer periphery of the wafer. Further, the table includes a holding means () for holding the wafer to the front surface of the table and a suction means for suction of the air in the groove. Thus, the dicing film can be positively collapsed in the groove while at the same time being restored to the original position.


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Kino, Hideo. (2012). Wafer table, surface protective film peeling apparatus and surface protective film peeling method (U.S. Patent No. 8182632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8182632

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