The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Jan. 06, 2009
Applicants:

Akio Watanabe, Ota, JP;

Akihiro Kawai, Isesaki, JP;

Tetsuji Ono, Ora-Gun, JP;

Makio Kameda, Fukaya, JP;

Kazuyoshi Oyama, Ashikaga, JP;

Inventors:

Akio Watanabe, Ota, JP;

Akihiro Kawai, Isesaki, JP;

Tetsuji Ono, Ora-Gun, JP;

Makio Kameda, Fukaya, JP;

Kazuyoshi Oyama, Ashikaga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.


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