The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

Mar. 24, 2006
Applicants:

Hiroaki Hatanaka, Yokohama, JP;

Nobukazu Ido, Chigasaki, JP;

Minoru Tagami, Yokosuka, JP;

Inventors:

Hiroaki Hatanaka, Yokohama, JP;

Nobukazu Ido, Chigasaki, JP;

Minoru Tagami, Yokosuka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/22 (2006.01); G01B 11/02 (2006.01); G01B 11/06 (2006.01); G01B 15/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to quantitatively evaluate a distribution of defects which are generated within an inspection material. In order to achieve this object, the present invention provides a defect inspection apparatus comprising: an ultrasonic wave probe; an ultrasonic wave transmitting and receiving device that irradiates ultrasonic waves via the ultrasonic wave probe onto a surface of an inspection material on which a predetermined propagation medium has been provided, and that also receives as noise signals ultrasonic waves that have been scattered by defects present in the interior of the inspection material; a frequency spectrum calculation device that performs time division on the noise signals so as to divide them into time widths that correspond to positions in the depth direction of the inspection material, and calculates a frequency spectrum for each one of the time-divided noise signals; and a defect distribution detection device that, based on the frequency spectrums, calculates values showing a level of defect progression corresponding to a position in the thickness direction of the inspection material.


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