The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
May. 27, 2009
Zhen Zhang, Santa Clara, CA (US);
Frank Kuechenmeister, Dresden, DE (US);
Jaime Bravo, Santiago, CL;
Michael Su, Round Rock, TX (US);
Ranjit Gannamani, San Jose, CA (US);
Kevin Lim, Sunnyvale, CA (US);
Zhen Zhang, Santa Clara, CA (US);
Frank Kuechenmeister, Dresden, DE (US);
Jaime Bravo, Santiago, CL;
Michael Su, Round Rock, TX (US);
Ranjit Gannamani, San Jose, CA (US);
Kevin Lim, Sunnyvale, CA (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
Methods are provided for packaging a semiconductor die having a first surface. In accordance with an exemplary embodiment, a method comprises the steps of forming a trench in the first surface of the die, electrically and physically coupling the die to a packaging substrate, forming a sealant layer on the first surface of the die, forming an engagement structure within the trench, and infusing underfill between the sealant layer and the engagement structure and the packaging substrate.