The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Jul. 15, 2009
Kong-beng Thei, Hsin-Chu, TW;
Chung Long Cheng, Hsin-Chu, TW;
Chung-shi Liu, Hsin-Chu, TW;
Harry Chuang, Austin, TX (US);
Shien-yang Wu, Hsin-Chu, TW;
Shi-bai Chen, Tai-Chung, TW;
Kong-Beng Thei, Hsin-Chu, TW;
Chung Long Cheng, Hsin-Chu, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Harry Chuang, Austin, TX (US);
Shien-Yang Wu, Hsin-Chu, TW;
Shi-Bai Chen, Tai-Chung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.