The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Oct. 06, 2010
Noritomo Mitsugi, Tokyo, JP;
Masataka Hourai, Tokyo, JP;
Shuichi Samata, Tokyo, JP;
Kiyoshi Nagai, Tokyo, JP;
Kei Matsumoto, Tokyo, JP;
Noritomo Mitsugi, Tokyo, JP;
Masataka Hourai, Tokyo, JP;
Shuichi Samata, Tokyo, JP;
Kiyoshi Nagai, Tokyo, JP;
Kei Matsumoto, Tokyo, JP;
Sumco Corporation, Tokyo, JP;
Abstract
To provide a method of removing a heavy metal contained in a thinned semiconductor substrate. A method of removing a heavy metal in a semiconductor substrate of the present invention comprises: attaching, to a rear surface of the semiconductor substrate, a material that lowers a potential barrier of the rear surface of the semiconductor substrate, on a front surface of which a circuit is to be formed or is formed; applying a thermal treatment to the semiconductor substrate under a condition based on a thickness and a resistivity of the semiconductor substrate; and, depositing the heavy metal in the semiconductor substrate on the rear surface.