The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
Aug. 31, 2007
Applicant:
Hyun Uk Kim, Seoul, KR;
Inventor:
Hyun Uk Kim, Seoul, KR;
Assignees:
Stats Chippac Ltd., Singapore, SG;
Stats Chippac, Inc., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package on package system is provided including providing a first substrate having a first integrated circuit thereon and a second substrate having a second integrated circuit thereon, the second substrate having a recess provided therein. The first and second substrates are mounted having the first integrated circuit at least partially nested in the recess.
Kim, Hyun. (2012). Nested integrated circuit package on package system (U.S. Patent No. 8169064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8169064
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