The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2012

Filed:

Apr. 30, 2010
Applicants:

Hideo Mizutani, Ogaki, JP;

Toshiyuki Matsui, Ogaki, JP;

Atsushi Deguchi, Ogaki, JP;

Inventors:

Hideo Mizutani, Ogaki, JP;

Toshiyuki Matsui, Ogaki, JP;

Atsushi Deguchi, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.


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