The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Apr. 19, 2006
David Noice, Palo Alto, CA (US);
Gary Nunn, Los Gatos, CA (US);
Inhwan Seo, Fremont, CA (US);
William Kao, Fremont, CA (US);
Xiaopeng Dong, San Jose, CA (US);
David Noice, Palo Alto, CA (US);
Gary Nunn, Los Gatos, CA (US);
Inhwan Seo, Fremont, CA (US);
William Kao, Fremont, CA (US);
Xiaopeng Dong, San Jose, CA (US);
Cadence Design Systems, Inc., San Jose, CA (US);
Abstract
An improved approach for implementing metal fill on an electrical device without causing creating cross-coupling capacitance problems is disclosed. Timing aware metal fill insertion is performed to avoid or minimize cross-capacitance problems on the IC design. A cost may be assigned to different candidate metal fill shapes. The cost is associated with the expected effect upon timing requirements by the metal fill shape, with lower costs corresponding to lower expected impacts upon the timing requirements. To meet density requirements, lower cost metal fill shapes are inserted prior to higher cost metal fill shapes.