The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Oct. 06, 2009
Oleg Gluschenkov, Hopewell Junction, NY (US);
Muthukumarasamy Karthikeyan, Hopewell Junction, NY (US);
Yunsheng Song, Hopewell Junction, NY (US);
Tso-hui Ting, Hopewell Junction, NY (US);
Richard P. Volant, Hopewell Junction, NY (US);
Ping-chuan Wang, Hopewell Junction, NY (US);
Oleg Gluschenkov, Hopewell Junction, NY (US);
Muthukumarasamy Karthikeyan, Hopewell Junction, NY (US);
Yunsheng Song, Hopewell Junction, NY (US);
Tso-Hui Ting, Hopewell Junction, NY (US);
Richard P. Volant, Hopewell Junction, NY (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A set of first substrate and second substrate are manufactured with a built-in N-fold rotational symmetry around the center axis of each substrate, wherein N is an integer greater than 1. A set of N different interposers is provided such that an i-th interposer provides electrical connection between the first substrate and the second substrate with a rotational angle of (i−1)/N×2π. The first and second substrates are tested with each of the N different interposers therebetween. Once the rotational angle that provides the highest stacked chip yield is determined, the first and the second substrates can be bonded with an azimuthal rotation that provides the highest stacked chip yield.