The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Sep. 18, 2007
Applicants:
Bing Dang, Chappaqua, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Luc Guerin, Quebec, CA;
Chirag S. Patel, Peerkskill, NY (US);
Inventors:
Bing Dang, Chappaqua, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Luc Guerin, Quebec, CA;
Chirag S. Patel, Peerkskill, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.