The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Sep. 13, 2010
Applicants:
Edward Fuergut, Dasing, DE;
Markus Fink, Zell, DE;
Inventors:
Edward Fuergut, Dasing, DE;
Markus Fink, Zell, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23P 23/00 (2006.01); B28B 1/54 (2006.01);
U.S. Cl.
CPC ...
Abstract
The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the compression molding apparatus and the semiconductor chips are encapsulated in a mold material by compression molding. During compression molding a heat transfer from the first tool to an upper surface of the carrier is delayed.