The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Dec. 14, 2006
Tetsuro Nishimura, Osaka, JP;
Tetsuro Nishimura, Osaka, JP;
Nihon Superior Sha Co., Ltd., , JP;
Abstract
An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatusdeposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bathfor causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bathincluding platesandfor allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bathfor causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.