Pattern evaluation method, computer-readable recording medium, and manufacturing method of semiconductor device

Abstract

A pattern evaluation method includes: acquiring data of a design pattern for an evaluation pattern to detect a first edge of the design pattern; acquiring an image of the evaluation pattern to detect a second edge of the evaluation pattern; dividing the first edge into first linear parts and first corner parts; performing matching of the first and second edges to obtain correspondence between the first and second edges; dividing the second edge into second linear parts and second corner parts based on the correspondence between the first and second edges; and evaluating the evaluation pattern based on at least one of the second linear parts and the second corner parts.